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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/12/2021
Application #:
16523573
Filing Dt:
07/26/2019
Publication #:
Pub Dt:
02/06/2020
Inventors:
Takashi ARAI, Fumimasa KATAGIRI, Katsuya FUKASE
Title:
WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
Assignment: 1
Reel/Frame:
049874/0899Recorded: 07/26/2019Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/17/2019
Exec Dt:
06/17/2019
Exec Dt:
06/17/2019
Assignee:
80, OSHIMADA-MACHI
NAGANO-SHI, NAGANO-KEN, JAPAN 381-2287
Correspondent:
TAROLLI, SUNDHEIM, COVELL & TUMMINO L.L.
1300 EAST NINTH STREET, SUITE 1700
CLEVELAND, OH 44114

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