Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/17/2022
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Application #:
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16465233
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Filing Dt:
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05/30/2019
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Publication #:
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Pub Dt:
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02/06/2020
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Inventors:
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Chuan Hu, Junjun Liu, Yuejin Guo, Edward Rudolph Prack
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Title:
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INTEGRATED CIRCUIT PACKAGING METHOD AND INTEGRATED PACKAGING CIRCUIT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ROOM 601, BUILDING 2, ZHNOGJIAN INDUSTRIAL BUILDING |
| NO. 18 YANSHAN ROAD, SHEKOU STREET, NANSHAN DISTRICT, GUANGDONG |
| SHENZHEN, CHINA 518067 |
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| HOGAN LOVELLS US LLP - SAN FRANCISCO |
| 3 EMBARCADERO CENTER, 15TH FLOOR |
| SAN FRANCISCO, CA 94111 |
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