Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/29/2020
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Application #:
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16431751
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Filing Dt:
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06/05/2019
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Publication #:
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Pub Dt:
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03/05/2020
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Inventors:
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Hung-Jui Kuo, Hui-Jung Tsai, Jyun-Siang Peng, Chien-Tang Peng
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Title:
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SEMICONDUCTOR PACKAGES HAVING A SEED LAYER STRUCTURE PROTRUDING FROM AN EDGE OF METAL STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
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