Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15745695
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Filing Dt:
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01/17/2018
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Publication #:
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Pub Dt:
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03/12/2020
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Inventors:
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Yun ZHANG, Tao MA, Jing Wang, Zifang ZHU, Luming CHEN
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Title:
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A METHOD FOR PREPARING ELECTROPLATING COPPER LAYER WITH PREFERRED GROWTH ORIENTATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2358 CHANGAN ROAD |
WUJIANG DISTRICT |
SUZHOU, JIANGSU, CHINA 215200 |
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SZDC LAW P.C. |
1629 K STREET N.W. |
SUITE 300 |
WASHINGTON, DC 20006 |
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06/08/2024 03:34 AM
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