Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/20/2020
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Application #:
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16134702
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Filing Dt:
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09/18/2018
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Publication #:
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Pub Dt:
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03/19/2020
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Inventors:
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Duane M. Egging, Kyong S. Kim, Stephen M. Young, Douglas J. Seiersen
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Title:
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Overhead Payload Module with Integrated Stowbins
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 100 NORTH RIVERSIDE PLAZA |
| CHICAGO, ILLINOIS 60606-1596 |
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| MCDONNELL BOEHNEN HULBERT & BERGHOFF LLP |
| 300 S. WACKER DRIVE |
| SUITE 3100 |
| CHICAGO, IL 60606 |
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