Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/16/2021
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Application #:
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16416421
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Filing Dt:
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05/20/2019
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Publication #:
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Pub Dt:
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03/26/2020
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Inventor:
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CHIA-YU WU
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Title:
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STACKED TYPE CAPACITOR PACKAGE STRUCTURE WITHOUT CARBON PASTE LAYER, STACKED TYPE CAPACITOR THEREOF, AND POLYMER COMPOSITE LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6F.-5, NO.57, LN. 69, JINGYE 2ND RD., ZHONGSHAN DIST. |
| TAIPEI CITY, TAIWAN 104 |
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| LI&CAI INTELLECTUAL PROPERTY(USA) OFFICE |
| 3057 NUTLEY STREET |
| SUITE 818 |
| FAIRFAX, VA 22031 |
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