Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/15/2020
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Application #:
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16539980
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Filing Dt:
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08/13/2019
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Publication #:
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Pub Dt:
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03/26/2020
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Inventors:
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CHANG-SEONG JEON, SEUNG-HUN SHIN, JAE-KYUNG YOO, TEAK-HOON LEE
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Title:
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METHOD OF CUTTING SUBSTRATE AND METHOD OF SINGULATING SEMICONDUCTOR CHIPS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 129, SAMSUNG-RO, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677 |
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| VOLENTINE, WHITT & FRANCOS, PLLC |
| 11951 FREEDOM DRIVE, SUITE 1300 |
| RESTON, VA 20190 |
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