Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16143212
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Filing Dt:
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09/26/2018
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Publication #:
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Pub Dt:
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03/26/2020
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Inventors:
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David O'SULLIVAN, Bernd WAIDHAS, Richard PATTEN, Georg SEIDEMANN
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Title:
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NOVEL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP), FLIP-CHIP CHIP SCALE PACKAGE (FCCSP), AND FAN OUT SHIELDING CONCEPTS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2200 MISSION COLLEGE BOULEVARD |
SANTA CLARA, CALIFORNIA 95054 |
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JUSTIN K. BRASK |
1211 SW 5TH AVENUE, STE. 1600 |
PORTLAND, OR 97204 |
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06/03/2024 05:11 AM
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