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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
16141415
Filing Dt:
09/25/2018
Publication #:
Pub Dt:
03/26/2020
Inventors:
Debendra Mallik, Robert L. Sankman, Sanka Ganesan, George Vakanas, Omkar Karhade et al
Title:
STACKED WIRE-BOND DICE ATTACHED BY PILLARS OR BUMPS ABOVE A FLIP-CHIP DIE ON A SEMICONDUCTOR PACKAGE SUBSTRATE
Assignment: 1
Reel/Frame:
051929/0391Recorded: 02/26/2020Pages: 15
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/23/2018
Exec Dt:
10/24/2018
Exec Dt:
10/23/2018
Exec Dt:
10/25/2018
Exec Dt:
10/26/2018
Exec Dt:
10/25/2018
Exec Dt:
10/24/2019
Exec Dt:
12/19/2019
Assignee:
2200 MISSION COLLEGE BLVD.
SANTA CLARA, CALIFORNIA 95054
Correspondent:
SCHWEGMAN LUNDBERG & WOESSNER, P.A.
P.O. BOX 2938
MINNEAPOLIS, MN 55402
Assignment: 2
Reel/Frame:
057749/0095Recorded: 10/07/2021Pages: 16
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE THE NAME AND EXECUTION DATE FOR THE 7TH INVENTOR PREVIOUSLY RECORDED AT REEL: 051929 FRAME: 0391. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
Exec Dt:
10/23/2018
Exec Dt:
10/24/2018
Exec Dt:
10/23/2018
Exec Dt:
10/25/2018
Exec Dt:
10/26/2018
Exec Dt:
10/25/2018
Exec Dt:
10/24/2018
Exec Dt:
12/19/2019
Assignee:
2200 MISSION COLLEGE BLVD.
SANTA CLARA, CALIFORNIA 95054
Correspondent:
SCHWEGMAN LUNDBERG & WOESSNER, P.A.
P.O. BOX 2938
MINNEAPOLIS, MN 55402

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