Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/01/2021
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Application #:
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16598772
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Filing Dt:
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10/10/2019
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Publication #:
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Pub Dt:
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04/16/2020
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Inventors:
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Kai-Hung Yu, David O'Meara, Nicholas Joy, Gyanaranjan Pattanaik, Robert Clark et al
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Title:
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METHOD FOR FILLING RECESSED FEATURES IN SEMICONDUCTOR DEVICES WITH A LOW-RESISTIVITY METAL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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AKASAKA BIZ TOWER |
3-1 AKASAKA 5-CHOME, MINATO-KU |
TOKYO, JAPAN 107-6325 |
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TOKYO ELECTRON U.S. HOLDINGS, INC. |
2400 GROVE BLVD. |
AUSTIN, TX 78741 |
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