Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/05/2021
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Application #:
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16264602
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Filing Dt:
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01/31/2019
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Publication #:
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Pub Dt:
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04/16/2020
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Inventors:
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Chih-Cheng LEE, Chen Yuang CHEN, Cheng-Lin HO, Chun Chen CHEN
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Title:
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SEMICONDUCTOR DEVICE PACKAGE, ELECTRONIC ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE |
| KAOHSIUNG, TAIWAN |
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| FOLEY & LARDNER LLP |
| 3000 K STREET, N.W. |
| SUITE 600 |
| WASHINGTON, DC 20007 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE FIRST AND MIDDLE NAME OF THE FOURTH INVENTOR PREVIOUSLY RECORDED ON REEL 048375 FRAME 0934. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| 26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE |
| KAOHSIUNG, TAIWAN |
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| FOLEY & LARDNER LLP |
| 3000 K STREET, N.W. |
| SUITE 600 |
| WASHINGTON, DC 20007 |
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