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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
07/11/2023
Application #:
16666504
Filing Dt:
10/29/2019
Publication #:
Pub Dt:
04/30/2020
Inventors:
Howon Lee, Giuseppe Barillaro, Riddish Morde, Emanuele Vignali
Title:
3D PRINTED MICRONEEDLE ASSEMBLIES
Assignment: 1
Reel/Frame:
051342/0683Recorded: 12/20/2019Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/11/2019
Exec Dt:
12/18/2019
Exec Dt:
12/14/2019
Exec Dt:
12/16/2019
Assignee:
83 SOMERSET STREET
NEW BRUNSWICK, NEW JERSEY 08901
Correspondent:
LERNER, DAVID, LITTENBERG, KRUMHOLZ & MENTLIK, LLP
20 COMMERCE DRIVE
CRANFORD, NJ 07016
Assignment: 2
Reel/Frame:
061203/0493Recorded: 08/17/2022Pages: 3
Conveyance:
NUNC PRO TUNC ASSIGNMENT (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/27/2022
Assignee:
LUNGARNO ANTONIO PACINOTTI 43/44
PISA, ITALY I-56126
Correspondent:
LERNER, DAVID, LITTENBERG, KRUMHOLZ & MENTLIK, LLP
20 COMMERCE DR.
CRANFORD, NJ 07016

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