Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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04/12/2022
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Application #:
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16668038
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Filing Dt:
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10/30/2019
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Publication #:
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Pub Dt:
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04/30/2020
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Inventors:
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Markus Dinkel, Petteri Palm, Eung San Cho, Josef Hoeglauer, Ralf Otremba, Fabian Schnoy
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Title:
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Semiconductor Package and Method of Fabricating a Semiconductor Package
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 101 N. SEPULVEDA BLVD. |
| EL SEGUNDO, CALIFORNIA 90245 |
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| MURPHY, BILAK & HOMILLER/INFINEON TECHNO |
| 1255 CRESCENT GREEN |
| SUITE 200 |
| CARY, NC 27518 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SIEMENSSTRASSE 2 |
| VILLACH, AUSTRIA 9500 |
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| MURPHY, BILAK & HOMILLER/INFINEON TECHNO |
| 1255 CRESCENT GREEN |
| SUITE 200 |
| CARY, NC 27518 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SIEMENSSTRASSE 2 |
| VILLACH, AUSTRIA A-9500 |
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| IRIS DRUCKENBROD |
| AM CAMPEON 1-15 |
| PATENT DEPARTMENT MUC/11.2.348 |
| NEUBIBERG, 85579 GERMANY |
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