Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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10/19/2021
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Application #:
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16664568
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Filing Dt:
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10/25/2019
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Publication #:
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Pub Dt:
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04/30/2020
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Inventors:
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Rennier RODRIGUEZ, Rammil SEGUIDO, Raymond Albert NARVADEZ, Michael TABIERA
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Title:
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SEMICONDUCTOR DIE WITH MULTIPLE CONTACT PADS ELECTRICALLY COUPLED TO A LEAD OF A LEAD FRAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 9 MOUNTAIN DRIVE, LIGHT INDUSTRY & SCIENCE |
| PARK II, BRGY LA MESA |
| CALAMBA CITY, PHILIPPINES 4027 |
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| SEED IP LAW GROUP LLP |
| 701 FIFTH AVENUE, SUITE 5400 |
| SEATTLE, WA 98104 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| CHEMIN DU CHAMP-DES-FILLES 39 |
| PLAN-LES-OUATES |
| GENEVA, SWITZERLAND 1228 |
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| RAJ K. KRISHNAN |
| STMICROELECTRONICS, INC. |
| 750 CANYON DRIVE, SUITE 300 |
| COPPELL, TX 75019 |
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