Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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06/16/2020
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Application #:
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16199668
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Filing Dt:
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11/26/2018
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Publication #:
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Pub Dt:
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05/07/2020
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Inventors:
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Po-Tsung Hsieh, Chia-Ming Yang, In-Gann Chen, Shih-Wen Tseng, Ya-Wen Tsai, Ya-Wen Chuang
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Title:
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CHIP PACKAGING DEVICE AND ALIGNMENT BONDING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 1, UNIVERSITY ROAD, |
| TAINAN CITY, TAIWAN 701 |
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| MUNCY, GEISSLER, OLDS & LOWE, PC |
| 4000 LEGATO RD., SUITE 310 |
| FAIRFAX, VA 22033 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 12F., NO. 65, GONGYUAN S. RD., NORTH DIST. |
| TAINAN CITY, TAIWAN 704 |
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| WPAT, PC INTELLECTUAL PROPERTY ATTORNEYS |
| 8230 BOONE BLVD, SUITE 405 |
| VIENNA, VA 22182 |
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