Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/28/2021
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Application #:
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16718156
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Filing Dt:
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12/17/2019
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Publication #:
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Pub Dt:
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05/28/2020
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Inventors:
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Chung-Che Tsai, Hsien-Chou Tsai
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Title:
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SEMICONDUCTOR PACKAGE WITH IN-PACKAGE COMPARTMENTAL SHIELDING AND ACTIVE ELECTRO-MAGNETIC COMPATIBILITY SHIELDING
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Assignment:
1
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INHERITANCE SYSTEM TABLE FOR PATENT APPLICATION
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| NO. 1, DUSING 1ST RD., HSINCHU SCIENCE PARK |
| HSINCHU CITY, TAIWAN |
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| 8F., NO. 38, LN. 168, SONGDE RD., XINYI DIST. |
| TAIPEI CITY, TAIWAN |
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| 3F., NO. 39, LN. 236, SEC. 5, ZHONGXIAO E. RD., XINYI DIST. |
| TAIPEI CITY, TAIWAN |
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| 13F, NO. 90, SONGKAO RD., XINYI DISTRICT |
| TAIPEI CITY, TAIWAN |
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| WINSTON HSU |
| 5F., NO.389, FUHE RD., YONGHE DIST., |
| NEW TAIPEI CITY, TAIWAN |
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