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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
16706962
Filing Dt:
12/09/2019
Publication #:
20200184299
Pub Dt:
06/11/2020
Inventors:
Yi WANG, He SONG, Yajun CAO, Fei TENG, Wei LI
Title:
CARD-MAKING SUBSTRATE AND PREPARATION METHOD THEREOF AND IC CARD OR ELECTRONIC TAG CONTAINING THE SAME
Assignment: 1
Reel/Frame:
051214/0016Recorded: 12/09/2019Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
WANG, YI
Exec Dt:
12/06/2019
SONG, HE
Exec Dt:
12/06/2019
CAO, YAJUN
Exec Dt:
12/06/2019
TENG, FEI
Exec Dt:
12/06/2019
LI, WEI
Exec Dt:
12/06/2019
Assignee:
TIANJIN BOYUAN NEW MATERIALS CO., LTD
AB APT., 5-6F, C1 BUILDING, NO.16 RONGYUAN RD.
INDUSTRY DEVELOPMENT AREA
TIANJIN, CHINA 300384
Correspondent:
MCDONALD HOPKINS LLC
600 SUPERIOR AVENUE, EAST
SUITE 2100
CLEVELAND, OH 44114-2653
Assignment: 2
Reel/Frame:
051506/0521Recorded: 01/08/2020Pages: 6
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE APPLICANT ADDRESS PREVIOUSLY RECORDED ON REEL 051214 FRAME 0016. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
WANG, YI
Exec Dt:
12/06/2019
SONG, HE
Exec Dt:
12/06/2019
CAO, YAJUN
Exec Dt:
12/06/2019
TENG, FEI
Exec Dt:
12/06/2019
LI, WEI
Exec Dt:
12/06/2019
Assignee:
TIANJIN BOYUAN NEW MATERIALS CO., LTD
AB APT., 5-6F, C1 BUILDING, NO. 16 RONGYUAN RD.
HUAYUAN INDUSTRY DEVELOPMENT AREA
TIANJIN, CHINA 300384
Correspondent:
MCDONALD HOPKINS LLC
600 SUPERIOR AVENUE, EAST
SUITE 2100
CLEVELAND, OH 44114-2653

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