Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/18/2021
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Application #:
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16375228
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Filing Dt:
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04/04/2019
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Publication #:
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Pub Dt:
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06/11/2020
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Inventors:
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Yuan Sheng Chiu, Tsung-Shu Lin, Chih-Kai Cheng
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Title:
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INTEGRATED CIRCUIT PACKAGE AND METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| SLATER MATSIL, LLP/TSMC |
| 17950 PRESTON ROAD, SUITE 1000 |
| DALLAS, TX 75252 |
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