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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/15/2020
Application #:
16791846
Filing Dt:
02/14/2020
Publication #:
Pub Dt:
06/11/2020
Inventors:
Bum Mo AHN, Seung Ho PARK, Tae Hwan SONG
Title:
METHOD FOR MANUFACTURING CHIP-MOUNTING SUBSTRATE, AND CHIP-MOUNTING SUBSTRATE
Assignment: 1
Reel/Frame:
054325/0870Recorded: 11/10/2020Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/12/2020
Exec Dt:
02/13/2020
Exec Dt:
02/11/2020
Assignee:
89, ASANVALLEY-RO, DUNPO-MYEON
CHUNGCHEONGNAM-DO
ASAN, KOREA, REPUBLIC OF 31409
Correspondent:
AMPACC LAW GROUP, PLLC
6100 219TH ST SW #580
MOUNTLAKE TERRACE, WA 98043

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