Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/29/2022
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Application #:
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16231637
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Filing Dt:
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12/24/2018
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Publication #:
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Pub Dt:
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06/25/2020
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Inventors:
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See Lok CHAN, Wan Yin YAU, Chi Wah CHENG
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Title:
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DIE BONDER INCORPORATING ROTATABLE ADHESIVE DISPENSER HEAD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2 YISHUN AVENUE 7 |
SINGAPORE, SINGAPORE 768924 |
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OSTROLENK FABER LLP |
845 THIRD AVENUE |
8TH FLOOR |
NEW YORK, NY 10022 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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2 YISHUN AVENUE 7 |
SINGAPORE, SINGAPORE 768924 |
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CPA GLOBAL |
CASTLE STREET , LIBERATION HOUSE |
ST HELIER, JERSEY, JE1 1BL JERSEY |
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09/23/2024 06:54 PM
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