Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/03/2020
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Application #:
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16255352
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Filing Dt:
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01/23/2019
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Publication #:
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Pub Dt:
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06/25/2020
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Inventors:
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SHIN-WEN CHEN, LONG-FEI ZHANG, KE-HUA FAN, KUN LI
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Title:
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LENS MODULE HAVING PHOTOSENSITIVE CHIP EMBEDDED IN THROUGH HOLE OF CIRCUIT BOARD AND ASSEMBLY METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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B2 BUILDING FOXCONN TECHNOLOGY GROUP,DONGHUAN 2ND ROAD,LONGHUA TOWN |
SHENZHEN, CHINA |
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TUNG-YUN MCNALLY |
550 S. HOPE STREET, SUITE 2825 |
LOS ANGELES, CA 90071 |
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