Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16722659
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Filing Dt:
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12/20/2019
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Publication #:
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Pub Dt:
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07/02/2020
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Inventors:
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Shunichiro I, Yasukazu Shikano
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Title:
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RESIN COMPOSITION AND MOLDED ARTICLE THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1-2 YURAKUCHO, |
| CHIYODA-KU, TOKYO, JAPAN 1000006 |
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| KENJA IP LAW PC |
| 4 NORTH SECOND STREET, SUITE 598 |
| SAN JOSE, CA 95113 |
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