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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/22/2020
Application #:
16698953
Filing Dt:
11/28/2019
Publication #:
Pub Dt:
07/02/2020
Inventors:
Rongzhe GUO, Chao ZOU
Title:
HIGH-DENSITY AND HIGH-POWER CARD CONNECTION TERMINAL AND CONNECTOR
Assignment: 1
Reel/Frame:
051134/0584Recorded: 11/28/2019Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/29/2018
Exec Dt:
12/03/2018
Assignee:
BLOCK D3, THE MOLDING TOOL INDUSTRY PARK, HONGGUANG TOWN, THE WEST DISTRICT OF GAO XIN, CHENGDU, CHINA
CHENGDU, CHINA
Correspondent:
GOKALP BAYRAMOGLU
1540 W. WARM SPRINGS ROAD SUITE 100
HENDERSON, NV 89014

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