Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/26/2024
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Application #:
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16643725
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Filing Dt:
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03/02/2020
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Publication #:
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Pub Dt:
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07/23/2020
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Inventors:
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Keiji MIKI, Shota HANAFUSA
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Title:
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HEAT SINK MODULE WITH THROUGH-HOLE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-10, FUSO-CHO |
| AMAGASAKI-SHI, HYOGO, JAPAN 660-0891 |
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| CROWELL & MORING LLP |
| 1001 PENNSYLVANIA AVENUE, NW |
| WASHINGTON, DC 20004 |
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05/02/2024 02:53 AM
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