Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/10/2020
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Application #:
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16535022
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Filing Dt:
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08/07/2019
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Publication #:
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Pub Dt:
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07/23/2020
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Inventors:
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Wen-Jung Tsai, Mao-Hua Yeh, Chih-Hsien Chiu, Ying-Chou Tsai, Chun-Chi Ke
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Title:
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ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 123, SEC. 3, DA FONG ROAD |
| TANTZU, TAICHUNG, TAIWAN |
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| MINTZ LEVIN |
| ONE FINANCIAL CENTER |
| BOSTON, MA 02111 |
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