Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
09/14/2021
|
Application #:
|
16559246
|
Filing Dt:
|
09/03/2019
|
|
Publication #:
|
|
Pub Dt:
|
08/06/2020
| | | | |
|
Inventors:
|
Yu-Chia Lai, Cheng-Chieh Hsieh, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu
|
|
Title:
|
Integrated Fan-Out Device, 3D-IC System, and Method
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
|
|
|
|
| SLATER MATSIL, LLP |
| 17950 PRESTON RD., SUITE 1000 |
| DALLAS, TX 75252 |
|
|
Search Results as of:
05/30/2024 11:52 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
