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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
11552026
Issue Dt:
01/10/2023
Application #:
16264599
Filing Dt:
01/31/2019
Publication #:
20200251421
Pub Dt:
08/06/2020
Inventors:
Cheng Yuan CHEN, Jiming LI, Yuanhao YU, Chun Chen CHEN
Title:
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
Assignment: 1
Reel/Frame:
048245/0018Recorded: 02/05/2019Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
CHEN, CHEN YUANG
Exec Dt:
01/31/2019
LI, JIMING
Exec Dt:
01/31/2019
CHEN, CHUN CHEN
Exec Dt:
01/31/2019
YU, YUANHAO
Exec Dt:
01/31/2019
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE
KAOHSIUNG, TAIWAN
Correspondent:
FOLEY & LARDNER LLP
3000 K STREET, N.W.
SUITE 600
WASHINGTON, DC 20007
Assignment: 2
Reel/Frame:
059629/0295Recorded: 02/10/2022Pages: 6
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE FIRST INVENTOR MIDDLE NAME PREVIOUSLY RECORDED AT REEL: 048245 FRAME: 0018. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT .
Assignors:
CHEN, CHENG YUAN
Exec Dt:
05/27/2021
LI, JIMING
Exec Dt:
01/31/2019
CHEN, CHUN CHEN
Exec Dt:
01/31/2019
YU, YUANHAO
Exec Dt:
01/31/2021
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE
KAOHSIUNG, TAIWAN
Correspondent:
FOLEY & LARDNER LLP
3000 K STREET, N.W.
SUITE 600
WASHINGTON, DC 20007

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