Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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07/12/2022
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Application #:
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16866050
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Filing Dt:
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05/04/2020
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Publication #:
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Pub Dt:
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08/20/2020
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Inventors:
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Ki Wook Jung, Ercan M. Dede, Feng Zhou
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Title:
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MULTI-LAYER COOLING STRUCTURE INCLUDING THROUGH-SILICON VIAS THROUGH A PLURALITY OF DIRECTLY-BONDED SUBSTRATES AND METHODS OF MAKING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6565 HEADQUARTERS DRIVE W1-3C |
| PLANO, TEXAS 75024 |
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| DINSMORE & SHOHL LLP |
| 255 EAST FIFTH STREET, SUITE 1900 |
| CINCINNATI, OH 45202 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1, TOYOTA-CHO, TOYOTA-SHI |
| AICHI-KEN, JAPAN 471-8571 |
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| DINSMORE & SHOHL LLP |
| 255 E. FIFTH STREET |
| SUITE 1900 |
| CINCINNATI, OH 45202 |
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