Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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10/12/2021
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Application #:
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16673032
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Filing Dt:
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11/04/2019
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Publication #:
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Pub Dt:
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08/27/2020
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Inventors:
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Seung Woo Lee, Byong Jin Kim, Won Bae Bang, Sang Goo Kang
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Title:
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METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE USING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2045 E. INNOVATION CIRCLE |
| TEMPE, ARIZONA 85284 |
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| MCANDREWS, HELD & MALLOY, LTD. |
| 500 W. MADISON STREET |
| 3400 |
| CHICAGO, IL 60661 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 491 B RIVER VALLEY ROAD |
| VALLEY POINT #12/03 |
| SINGAPORE, SINGAPORE 248373 |
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| MCANDREWS, HELD & MALLOY, LTD. |
| 500 W. MADISON STREET |
| 3400 |
| CHICAGO, IL 60661 |
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