Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/28/2021
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Application #:
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16521596
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Filing Dt:
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07/25/2019
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Publication #:
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Pub Dt:
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08/27/2020
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Inventors:
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Hung-Hsin Hsu, Shang-Yu Chang Chien, Nan-Chun Lin
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Title:
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SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO.26, DATONG RD., HUKOU TOWNSHIP, |
HSINCHU COUNTY, TAIWAN 30352 |
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JCIPRNET |
P.O. BOX 600 TAIPEI GUTING |
TAIPEI CITY, 10099 TAIWAN |
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09/23/2024 08:02 PM
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