Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/08/2021
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Application #:
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16398764
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Filing Dt:
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04/30/2019
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Publication #:
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Pub Dt:
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09/17/2020
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Inventors:
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ZI-QING XIA, XIAO-LEI LIU, MIN CHEN, YI-KUN WANG, FU-JU ZENG
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Title:
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SOLDER PASTE PRINTING QUALITY INSPECTION SYSTEM AND METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 888, HE ZUO ROAD, GAO-XIN WEST DIST.,CHENGDU CITY, SICHUAN PROVINCE |
| CHENGDU, CHINA |
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| 66, CHUNG SHAN ROAD, TU-CHENG DIST. |
| NEW TAIPEI, TAIWAN |
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| TUNG-YUN MCNALLY |
| 550 S. HOPE STREET, SUITE 2825 |
| LOS ANGELES, CA 90071 |
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