Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/15/2022
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Application #:
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16351026
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Filing Dt:
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03/12/2019
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Publication #:
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Pub Dt:
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09/17/2020
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Inventors:
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Yu-Ju LIAO, Chien-Fan CHEN, Chien-Hao WANG, I-Chia LIN
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Title:
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EMBEDDED COMPONENT PACKAGE STRUCTURE, EMBEDDED TYPE PANEL SUBSTRATE AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 10, XINJING 1ST RD., NANTZE EXPORT PROCESSING ZONE |
| KAOHSIUNG, TAIWAN 811 |
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| INNOVATION COUNSEL LLP |
| 2890 ZANKER ROAD, SUITE 200 |
| SAN JOSE, CA 95134 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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| NO. 26, CHIN 3RD RD |
| NANTZE EXPORT PROCESSING ZONE |
| KAOHSIUNG, TAIWAN |
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| FOLEY & LARDNER LLP |
| 3000 K STREET, NW |
| SUITE 600 |
| WASHINGTON, DC 20007-5109 |
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