Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/20/2022
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Application #:
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16789449
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Filing Dt:
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02/13/2020
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Publication #:
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Pub Dt:
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09/24/2020
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Inventors:
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Hiroshi Take, Makoto Yoshida, Anthony Reymund Melad Binarao, Cheng Bu Heng
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Title:
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MEMS Package, MEMS Microphone and Method of Manufacturing the MEMS Package
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SAE TECHNOLOGY CENTRE, 6 SCIENCE PARK EAST AVENUE |
| HONG KONG SCIENCE PARK, SHATIN, N.T. |
| HONG KONG, HONG KONG |
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| BYIP LTD. |
| 5700 GRANITE PARKWAY, SUITE 200 |
| PLANO, TX 75024 |
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05/09/2024 09:28 PM
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