Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/03/2023
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Application #:
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16646905
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Filing Dt:
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03/12/2020
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Publication #:
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Pub Dt:
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09/24/2020
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Inventor:
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Sung-Baek DAN
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Title:
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THIN FILM CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 91, GIMPO-DAERO 1950BEON-GIL, TONGJIN-EUP |
| GIMPO-SI, GYEONGGI-DO, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF 10014 |
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| BAKER & HOSTETLER LLP |
| WASHINGTON SQUARE, SUITE 1100 |
| 1050 CONNECTICUT AVENUE, N.W. |
| WASHINGTON, DC 20036 |
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