Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/15/2022
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Application #:
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16822358
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Filing Dt:
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03/18/2020
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Publication #:
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Pub Dt:
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09/24/2020
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Inventor:
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Luc DALLASERRA
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Title:
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DISSIPATING INTERCONNECTION MODULE FOR M.2 FORM FACTOR EXPANSION CARD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| RUE JEAN JAURÈS |
| LES CLAYES-SOUS-BOIS, FRANCE 78340 |
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| PILLSBURY WINTHROP SHAW PITTMAN, LLP |
| PO BOX 10500 |
| MCLEAN, VA 22102 |
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Assignment:
2
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PARTIAL ASSIGNMENT AGREEMENT
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| 25 RUE LEBLANC |
| BÂTIMENT "LE PONANT D" |
| PARIS, FRANCE 75015 |
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| JOSEPH J. MAYO; ARC IP LAW, PC |
| 5749 LA JOLLA BLVD |
| LA JOLLA, CA 92037 |
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