Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16836616
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Filing Dt:
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03/31/2020
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Publication #:
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Pub Dt:
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09/24/2020
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Inventor:
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Rameen Hadizadeh
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Title:
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METHODS AND DEVICES FOR SOLDERLESS INTEGRATION OF MULTIPLE SEMICONDUCTOR DIES ON FLEXIBLE SUBSTRATES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 20 FAIRBANKS |
| IRVINE, CALIFORNIA 92618 |
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| JENKINS, WILSON, TAYLOR & HUNT |
| 3015 CARRINGTON MILL BLVD |
| SUITE 550 |
| MORRISVILLE, NC 27560 |
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