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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
03/01/2022
Application #:
16815365
Filing Dt:
03/11/2020
Publication #:
Pub Dt:
09/24/2020
Inventors:
Luc DALLASERRA, Marc RAETH
Title:
HEATSINK FOR MULTIPLE MEMORY MODULES
Assignment: 1
Reel/Frame:
052083/0265Recorded: 03/11/2020Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/06/2020
Exec Dt:
03/06/2020
Assignee:
RUE JEAN JAURÈS
LES CLAYES-SOUS-BOIS, FRANCE 78340
Correspondent:
THOMAS F. QUINN, JR.
3061 COMMERCE DRIVE
SUITE 1
FORT GRATIOT, MI 48059
Assignment: 2
Reel/Frame:
065629/0404Recorded: 11/20/2023Pages: 8
Conveyance:
PARTIAL ASSIGNMENT AGREEMENT
Assignor:
Exec Dt:
07/04/2023
Assignee:
25 RUE LEBLANC
BÂTIMENT "LE PONANT D"
PARIS, FRANCE 75015
Correspondent:
JOSEPH J. MAYO; ARC IP LAW, PC
5749 LA JOLLA BLVD
LA JOLLA, CA 92037

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