Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/05/2023
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Application #:
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16769786
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Filing Dt:
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06/04/2020
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Publication #:
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Pub Dt:
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10/01/2020
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Inventors:
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Ju Hyeon KIM, Junghak KIM, Seunghee NAM, Kwang Joo LEE
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Title:
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ADHESIVE COMPOSITION FOR SEMICONDUCTOR CIRCUIT CONNECTION AND ADHESIVE FILM INCLUDING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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128, YEOUI-DAERO, YEONGDEUNGPO-GU |
SEOUL, KOREA, REPUBLIC OF 07336 |
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ROTHWELL, FIGG, ERNST & MANBECK, P.C. |
607 14TH STREET, N.W., SUITE 800 |
WASHINGTON, DC 20005 |
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