Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/08/2022
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Application #:
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16827193
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Filing Dt:
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03/23/2020
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Publication #:
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Pub Dt:
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10/01/2020
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Inventors:
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Johannes Stahr, Mike Morianz, Andreas Zluc, Heinz Moitzi
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Title:
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Component Carrier With Embedded Semiconductor Component and Embedded Highly-Conductive Block Which are Mutually Coupled
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| FABRIKSGASSE 13 |
| LEOBEN, AUSTRIA 8700 |
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| SMITH TEMPEL BLAHA LLC DOCKETING DEPARTM |
| 50 GLENLAKE PARKWAY, SUITE 340 |
| ATLANTA, GA 30328 |
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