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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
16761972
Filing Dt:
05/06/2020
Publication #:
Pub Dt:
10/15/2020
Inventors:
Shriram RADHAKRISHNAN, David H. REID Jr., Aarne H. REID
Title:
THERMALLY-INSULATED MODULES AND RELATED METHODS
Assignment: 1
Reel/Frame:
052588/0065Recorded: 05/06/2020Pages: 10
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/02/2018
Exec Dt:
05/02/2018
Exec Dt:
05/08/2018
Exec Dt:
05/02/2018
Assignee:
593 WASHINGTON STREET
WELLESLEY, MASSACHUSETTS 02482
Correspondent:
BAKERHOSTETLER
CIRA CENTRE 12TH FLOOR
2929 ARCH STREET
PHILADELPHIA, PA 19104-2891
Assignment: 2
Reel/Frame:
052588/0107Recorded: 05/06/2020Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
04/29/2020
Assignee:
593 WASHINGTON STREET
WELLESLEY, MASSACHUSETTS 02482
Correspondent:
BAKERHOSTETLER
CIRA CENTRE 12TH FLOOR
2929 ARCH STREET
PHILADELPHIA, PA 19104-2891

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