Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16387924
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Filing Dt:
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04/18/2019
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Publication #:
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Pub Dt:
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10/22/2020
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Inventors:
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Tae Ki Kim, Jae Beom Shim, Seung Nam Son, Won Chul Do
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Title:
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CHIP SCALE PACKAGE INCLUDING PROTECTIVE LAYERS EXHIBITING COUNTERACTING COEFFICIENTS OF THERMAL EXPANSION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 100, AMKOR-RO, BUK-GU |
| GWANGJU, KOREA, REPUBLIC OF 61006 |
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| SPECTRUM IP LAW GROUP LLC |
| 558 CASTLE PINES PARKWAY |
| B4-362 |
| CASTLE PINES, CO 80108 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 491B RIVER VALLEY ROAD |
| VALLEY POINT #12-03 |
| SINGAPORE, SINGAPORE 248373 |
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| SPECTRUM IP LAW GROUP LLC |
| 558 CASTLE PINES PARKWAY |
| B4-362 |
| CASTLE PINES, CO 80108 |
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