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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
16732535
Filing Dt:
01/02/2020
Publication #:
Pub Dt:
10/29/2020
Inventors:
Chin-Chun Liao, Alex Horng
Title:
COOLING MODULE
Assignment: 1
Reel/Frame:
051399/0845Recorded: 01/02/2020Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/01/2019
Exec Dt:
11/01/2019
Assignee:
NO. 168, NANBAN ROAD.
KUNSHAN 215301, JIANGSU, CHINA
Correspondent:
MAYER & WILLIAMS, P.C.
55 MADISON AVENUE, SUITE 400
MORRISTOWN, NJ 07960

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