Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/29/2022
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Application #:
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16824899
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Filing Dt:
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03/20/2020
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Publication #:
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Pub Dt:
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10/29/2020
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Inventor:
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HSIU-WEN HSU
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Title:
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TRENCH POWER SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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9F.-1, NO.100, SEC. 1, JIAFENG 11TH RD., ZHUBEI CITY |
HSINCHU COUNTY, TAIWAN 30273 |
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LI&CAI INTELLECTUAL PROPERTY(USA) OFFICE |
3057 NUTLEY STREET |
SUITE 818 |
FAIRFAX, VA 22031 |
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09/23/2024 05:44 AM
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