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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
11101243
Issue Dt:
08/24/2021
Application #:
16680657
Filing Dt:
11/12/2019
Publication #:
20200350288
Pub Dt:
11/05/2020
Inventors:
Jongho PARK, Kyungsuk Oh, Hyunki Kim, Yongkwan Lee, Sangsoo Kim, Seungkon Mok, Junyoung Oh et al
Title:
SEMICONDUCTOR PACKAGE
Assignment: 1
Reel/Frame:
050978/0526Recorded: 11/12/2019Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
PARK, JONGHO
Exec Dt:
10/14/2019
OH, KYUNGSUK
Exec Dt:
10/16/2019
KIM, HYUNKI
Exec Dt:
10/14/2019
LEE, YONGKWAN
Exec Dt:
10/14/2019
KIM, SANGSOO
Exec Dt:
10/16/2019
MOK, SEUNGKON
Exec Dt:
10/29/2019
OH, JUNYOUNG
Exec Dt:
10/30/2019
YOO, CHANGYOUNG
Exec Dt:
10/30/2019
Assignee:
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO,, KOREA, REPUBLIC OF 16677
Correspondent:
LEE & MORSE, P.C.
3141 FAIRVIEW PARK DRIVE
SUITE 500
FALLS CHURCH, VA 22042

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