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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/31/2022
Application #:
16935625
Filing Dt:
07/22/2020
Publication #:
Pub Dt:
11/05/2020
Inventors:
Ken-Yen CHEN, Ray-Hua HORNG, Huan-Yu CHIEN
Title:
LIGHT EMISSION DIODE WITH FLIP-CHIP STRUCTURE AND MANUFACTURING METHOD THEREOF
Assignment: 1
Reel/Frame:
053279/0878Recorded: 07/22/2020Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/15/2020
Exec Dt:
07/13/2020
Exec Dt:
07/11/2020
Assignee:
NO.1001, DAXUE RD., EAST DIST.
HSINCHU CITY, TAIWAN 300
Correspondent:
RABIN & BERDO, P.C.
2650 PARK TOWER DRIVE, SUITE 800
VIENNA, VA 22180

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