Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
02/27/2024
|
Application #:
|
16407587
|
Filing Dt:
|
05/09/2019
|
|
Publication #:
|
|
Pub Dt:
|
11/12/2020
| | | | |
|
Inventors:
|
Robert Sankman, MD Altaf Hossain, Ankireddy Nalamalpu, Dheeraj Subbareddy
|
|
Title:
|
MICROELECTRONICS ASSEMBLY INCLUDING TOP AND BOTTOM PACKAGES IN STACKED CONFIGURATION WITH SHARED COOLING
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95054 |
|
|
|
|
| FINCH & MALONEY PLLC 50 COMMERCIAL STREE |
| GATEWAY ONE, SUITE 300 |
| MANCHESTER, NH 03101 |
|
|
Search Results as of:
06/14/2024 05:03 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
