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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/28/2023
Application #:
16638401
Filing Dt:
02/11/2020
Publication #:
Pub Dt:
11/19/2020
Inventors:
Hong Gu HWANG, Ick Kyung SUNG, Du Hwan KIM, Jung Seok HAHN, Haeshin LEE, Dai Heon LEE
Title:
ADHESIVE COMPOSITION, ADHESIVE COMPRISING SAME, AND MANUFACTURING METHOD THEREFOR
Assignment: 1
Reel/Frame:
051898/0164Recorded: 02/11/2020Pages: 14
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/13/2020
Exec Dt:
01/14/2020
Exec Dt:
01/13/2020
Exec Dt:
01/13/2020
Exec Dt:
01/09/2020
Exec Dt:
01/09/2020
Assignees:
110, MAGOKDONG-RO, GANGSEO-GU
SEOUL, KOREA, REPUBLIC OF 07793
291, DAEHAK-RO, YUSEONG-GU
DAEJEON, KOREA, REPUBLIC OF 34141
Correspondent:
SUGHRUE MION, PLLC
2000 PENNSYLVANIA AVENUE, N.W.
SUITE 900
WASHINGTON, DC 20006

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