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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/12/2022
Application #:
16993860
Filing Dt:
08/14/2020
Publication #:
Pub Dt:
11/26/2020
Inventors:
Bret K. Street, Wei Zhou, Jonathan S. Hacker, Christopher J. Gambee, Shijian Luo
Title:
Die Features for Self-Alignment During Die Bonding
Assignment: 1
Reel/Frame:
053500/0253Recorded: 08/14/2020Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/20/2018
Exec Dt:
08/16/2018
Exec Dt:
09/17/2018
Exec Dt:
08/09/2018
Exec Dt:
08/20/2018
Assignee:
8000 S. FEDERAL WAY
BOISE, IDAHO 83716
Correspondent:
PARSONS BEHLE & LATIMER - MICRON MICRON
800 W. MAIN STREET
SUITE 1300
BOISE, ID 83702

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