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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/16/2022
Application #:
16995941
Filing Dt:
08/18/2020
Publication #:
Pub Dt:
12/03/2020
Inventors:
Wei-Lun Hsu, Yung-Chien Kung, Ming-Tsung Yeh, Yan-Hsiu Liu, Am-Tay Luy, Yao-Pi Hsu et al
Title:
INTEGRATED CIRCUIT STRUCTURE WITH SEMICONDUCTOR DEVICES AND METHOD OF FABRICATING THE SAME
Assignment: 1
Reel/Frame:
053521/0157Recorded: 08/18/2020Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/06/2017
Exec Dt:
02/06/2017
Exec Dt:
02/06/2017
Exec Dt:
02/06/2017
Exec Dt:
02/06/2017
Exec Dt:
02/06/2017
Exec Dt:
02/06/2017
Assignee:
NO3, LI-HSIN RD.II, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 30078
Correspondent:
WPAT, PC INTELLECTUAL PROPERTY ATTORNEYS
8230 BOONE BLVD, SUITE 405
VIENNA, VA 22182

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