Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/20/2022
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Application #:
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16897372
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Filing Dt:
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06/10/2020
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Publication #:
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Pub Dt:
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12/10/2020
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Inventors:
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Chun-Hsien Yu, Pao-Hung Chou, Shih-Ping Hsu
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Title:
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SEMICONDUCTOR PACKAGE SUBSTRATE HAVING HEAT DISSIPATING METAL SHEET ON SOLDER PADS, METHOD FOR FABRICATING THE SAME, AND ELECTRONIC PACKAGE HAVING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 458-17, XINXING RD. |
| HUKOU TOWNSHIP |
| HSINCHU COUNTY, TAIWAN 30353 |
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| AMIN, TUROCY & WATSON, LLP |
| 200 PARK AVENUE |
| SUITE 300 |
| BEACHWOOD, OH 44122 |
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